Electroformed Stencils
Electroformed Stencils
AMTX E-FAB E Electroformed Stencils have set the standard for the SMT industry with superior printing characteristics and lower defect rates.
The AMTX E-FAB Electroformed Stencil is used extensively for (20 mil to 12 mil pitch) SMT applications. It is also used for µBGA’s, Flip Chip, and Wafer Bumping (12 mil to 6 mil pitch)
• Edition in CAD.
• Chem-Etch over “Mandrel”.
• E-Form Bath
Advantages:
Smooth, Trapezoidal Sidewalls:
Maximizes solder paste release.
Unsurpassed Tensile Strength and Hardness:
Increases stencil life.
Nickel Surface Properties:
Lowsurface energy enhances solder paste release.
Thickness:
Available in 1 to 12 mil thicknesses with 0.1 mil increments.
Precise Aperture Sizes:
Postprocessing size compensation not required.